您现在的位置:首页 - 产品中心 - CMP Polishing Fluid - SS series

Prepared from silicon oxide as raw material, suitable for sapphire processing with alkaline pH, suitable for multi piece processing technology.

产品说明

1. Adopting strict particle size control technology, it has the advantages of uniform particle size, moderate hardness, high polishing rate, small damage layer, and easy cleaning, which can obtain high-quality surfaces;

2. It can be diluted 1-3 times with pure water before use;

3. Customers can request to increase the concentration to 40%.

产品数据
ModelSS series
Product Attributes
Solid Content38%-42%
Acid-baseBasicity
Main IngredientSilicon Oxide

Application Scenarios

Fine Polishing

Processing Materials

Sapphire

注意事项

Storage conditions: Avoid direct sunlight, store at a temperature of 0-40 ℃. If it is below 0 ℃, it will produce jelly and be scrapped;

Warranty: 1 year;

Package: packed in IBC ton drums.